A10@kerala.party@kerala.partyM to Memes (മീമീസ്)@kerala.party · 1 year agoApple Event 2023 - Spoofed | Malayalam Sketchyoutu.beexternal-linkmessage-square5fedilinkarrow-up111arrow-down11
arrow-up110arrow-down1external-linkApple Event 2023 - Spoofed | Malayalam Sketchyoutu.beA10@kerala.party@kerala.partyM to Memes (മീമീസ്)@kerala.party · 1 year agomessage-square5fedilink
minus-squaredeven@kerala.partylinkfedilinkarrow-up2·1 year agoA system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the same die.
minus-squareA10@kerala.party@kerala.partyOPMlinkfedilinkarrow-up1·1 year agokind of like AMD chiplets but more integrated?, Intel is also going in that direction for packaging.
A system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the same die.
kind of like AMD chiplets but more integrated?, Intel is also going in that direction for packaging.
Yes. But with two ICs